emmc 5.1 Specification
Tech Spec
Capacity 4GB / 8GB / 16GB / 32GB / 64GB / 128GB / 256GB Interface HS400 Protocol standard eMMC5.1 NAND Flash 3D TLC Pin Configuration 153 Ball FBGA Dimensions (L x W x H) 11.5 x 13 x 1.0 mm Operating voltage (VCC/VCCQ) 3.3V/1.8Vor3.3V Sequential Read (Max*) Up to 330MB/s Sequential Write (Max*) Up to 250MB/s Operating Temperature -25°C-85°C Storage Temperature -40°C ~ 85°C Warranty 2-year limited warranty